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97.5Pb/2.5Ag

Product Overview

97.5Pb/2.5Ag is a relatively high temperature soft solder that flows easily due to its eutectic nature. It can be used to solder a number of ferrous and non-ferrous materials, though its most common application is for circuit boards. Due to its lead content, this solder should not be used in potable water applications.
  • Good flow

    • Typical Industry Applications:

    Circuit boards

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    Product Details

    Name:97.5Pb/2.5Ag

    Nominal Composition:Lead 97.50, Silver 2.50

    Liquidus:580 °F °, 304 °C

    Solidus:580 °F °, 304 °C

    Max Recommended Brazing Temperature:680 °F, 360 °C

    Heating Methods:Open Air

    Industry Specifications:

    • ASTM B32: Ag2.5
    • J Industry: Ag02B

    Common Industries

    .

    Electrical

    Lucas Milhaupt provides quality, high purity alloys to ensure brazed joints in power management components will last for years to come.