Powering Precision in Microelectronics

Join with the BEST - Down to the Last Micron

In the competitive microelectronics sector, manufacturers demand partners they can trust – those who provide high-purity alloys, precision fabrication for tiny components, and fast turnaround to meet aggressive development timelines. Lucas Milhaupt is a leading provider of brazing and soldering solutions, drawing on decades of materials science expertise and a portfolio of over 500 custom alloys to improve process efficiency and extend product life. As North America’s largest braze and solder alloy manufacturer, Lucas Milhaupt’s high-purity alloy offerings, including the Premabraze® Series (AuSn Premabraze 800 and AuGe Premabraze 880) – deliver exceptional bond strength, corrosion resistance, and thermal/electrical conductivity in micro-scale joints. By partnering with Lucas Milhaupt, microelectronics OEMs can achieve precise, reliable connections faster, empowering them to bring innovative electronics to market with confidence.

 

Why Choose Lucas Milhaupt

• Proven Industry Expertise: With a history in brazing dating back over 75 years, Lucas Milhaupt is a trusted authority in metal joining. The company is North America’s largest brazing alloy producer, and its vertically integrated manufacturing ensures complete quality and chemistry control at every step. This means you receive consistent, high-quality products every time.

• Precision Microfabrication: Lucas Milhaupt utilizes advanced fabrication technologies – including laser cutting, EDM, and precision stamping, to produce custom preforms and components with extremely tight tolerances. We have achieved wire diameters as small as 0.006″ and stamped foils down to 0.001″ thick, enabling reliable bonding even for the smallest and most complex parts. If your design demands micron-level accuracy or hermetic sealing, Lucas Milhaupt has the capability to deliver.

• High-Performance Alloys & Portfolio: As a one-stop shop for filler metals, Lucas Milhaupt offers an industry-leading portfolio ranging from gold-based solders to lead-free alloys. Our Premabraze® 800 and 880 series, provides high bond strength, excellent corrosion/oxidation resistance, and superior thermal conductivity, ideal for high-power and high-reliability electronics. With over 500 alloy formulations available, Lucas can supply the optimal material for virtually any microelectronic joining application.

• Collaborative Support & Speed-to-Market: Lucas Milhaupt’s technical experts work closely with your engineers from concept through production. Our brazing team has helped many microelectronic manufacturers design cost-effective joining methods and prototypes, utilizing in-house tooling to test new designs and small-run productions that keep you ahead of the competition. Equally important, Lucas Milhaupt is focused on rapid response, with set tooling lists and guaranteed quick-quote turnaround, we excel at meeting aggressive project deadlines and reducing overall lead times for critical materials. The result is a partner that not only provides products, but also ensures you get them when you need them, with full engineering support along the way.

 

Applications We Support

• Semiconductor Die Attach: Lucas Milhaupt supplies high-purity solders for attaching semiconductor chips (dies) to substrates or packaging. Our Premabraze® 880 (an 88% Au / 12% Ge eutectic alloy) is used for die attachment in many high-reliability chips, offering a robust bond with very low vapor pressure to maintain vacuum integrity during device operation. Whether for power transistors, LEDs, or integrated circuits, these solder alloys ensure a strong, void-free die attach that endures thermal cycling.

• Hermetic Package Sealing & Feedthroughs: We provide brazing alloys and preforms to create airtight, hermetic seals in microelectronic packages. Applications include sealing ceramic-to-metal packages, lid attachment, and brazing connector feedthroughs for sensors, medical implants, and aerospace electronics. Lucas Milhaupt’s high-purity alloys enable mission-critical hermetic seals that protect sensitive components from moisture and atmosphere, ensuring long-term reliability. From telecom packages to implantable devices, our materials help maintain the integrity of every sealed enclosure.

• RF & Microwave Components and Power Electronics: High-frequency and high-power electronic assemblies demand joining materials that can conduct electricity and heat efficiently while retaining strength. Lucas Milhaupt alloys fulfill these needs by providing excellent thermal and electrical transfer at the solder joint. This makes them ideal for RF microwave modules, telecommunications hardware, and power electronics (heat spreaders, laser diode submounts) where managing heat and ensuring signal integrity are critical. Our brazing solutions form reliable, low-resistance connections that stand up to the stresses of high current and high-frequency operation.

• Optoelectronics & Sensor Assemblies: From laser diodes and photonic packages to MEMS sensors and precision medical devices, Lucas Milhaupt supports advanced applications requiring miniature, ultra-reliable joins. As electronic designs shrink in size, our gold-based solders deliver the quality and consistency needed for these delicate components. We help enable hermetic sealing of optical components, bonding of sensor elements, and assembly of fiber-optic and imaging modules. The result is robust connectivity for optical and sensing devices used in industries like telecommunications, defense, aerospace, and medical – all backed by Lucas Milhaupt’s proven performance in micro-scale brazing.