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97.5Pb/1.5Ag/1Sn

Product Overview

97.5Pb/1.5Ag/1Sn is a relatively high temperature soft solder that flows easily due to its eutectic nature. It can be used to solder a number of ferrous and non-ferrous materials, though its most common application is for circuit boards. Due to its lead content, this solder should not be used in potable water applications.
  • Good flow
  • Typical Industry Applications:

    Circuit boards

    Product Details

    Name:97.5Pb/1.5Ag/1Sn

    Nominal Composition:Lead 97.50, Silver 1.50, Tin 1.00

    Liquidus:588 °F °, 309 °C

    Solidus:588 °F °, 309 °C

    Max Recommended Brazing Temperature:688 °F, 364 °C

    Heating Methods:Open Air

    Industry Specifications:

    • ASTM B32: Ag1.5
    • J Industry: Pb97B

    Common Industries

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    Electrical

    Lucas Milhaupt provides quality, high purity alloys to ensure brazed joints in power management components will last for years to come.