Brazing & Soldering Products

Lucas-Milhaupt offers the most comprehensive inventory of alloys and forms in the industry and our expertise in brazing and soldering ensures that we can find the best-matched products for your needs.

Technical Documentation

Visit our knowledge base for SDS and other technical documentation.

Download Technical Documents


HANDY FLO BRAZING PASTE® 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications under 450°C / 840°F. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with a hot water rinse. Typical formulations are up to 85% metal by weight.

Brazing and soldering pastes incorporate filler metal, flux, and a binder in a one-step application process. Because pastes are readily applied, they lend themselves well to both manual and automated production operations. We offer several flux/binder systems for specific temperature ranges and brazing processes.

Request a Quote

* Login required for document download.

Product Active Temperature RangeMinimum Shelf LifeWorking Characteristics Technical Documents* SDS Safety Documents
HANDY FLO® 801 Intermediate

Ideally suited for joining copper alloys, mild steels and most plated surfaces. Residue should be removed with hot water after soldering.

150°C - 275°C
300°F - 525°F 
3 months An intermediate chloride flux which is fluid and spreads well during heating. Good general purpose soldering system. Excellent stability.
HANDY FLO® 826 Intermediate
Works well on copper and copper alloys, mild steel and some stainless. Flame and resistance heat work best. Residue should be removed with hot water after soldering.
150°C - 315°C
300°F - 600°F 
3 months Zinc chloride free system that will not spread until molten. Very fluid flux.
HANDY FLO® 875/876 Corrosive

Easy-rinsing, water-based system works well on copper, brass steel and some stainless steel. Best suited for oven heat. Residue must be removed after soldering.

150°C - 275°C
300°F - 525°F 
3 months Restrictive, providing reasonable spread of filler metal. Ideal for templating applications.
HANDY FLO® 880 Halide Free

Works well on copper, brass and most plated surfaces. Residue may be left on parts after heating or easily removed with hot water if desired.

150°C - 275°C
300°F - 525°F 
3 months Will slump or fall into the joint area during the initial stages of heating.
Warranty Statement
This statement reflects the standard warranties of Lucas-Milhaupt, Inc. formulated products that include: brazing/soldering pastes, fluxes, and brazing aids.
0°C - 0°C
0°F - 0°F